Mixed-signal custom IC control processors incorporating design for test/self-test.

摘要

With the continued move towards higher integration and the concept of “systems on a chip”, the realisation of custom DSP chips aimed specifically at measurement/control systems is becoming a potential solution. Size reduction, operating speed increase, increased functionality and improved reliability can be achieved by using a single custom IC (ASIC) or multichip module (MCM) solution with the majority, or all, of the electronics mounted in a single package. Here, a DSP core optimised for the application surrounded by the necessary input/output signal conditioning circuitry can be used. However, the increased level of integration requires suitable fabrication processes and effective “design for test” to ensure the integrity of both the design functionality and fabrication.