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Local oxidation nanolithography on Hf thin films using atomic force microscopy (AFM)

机译:使用原子力显微镜(AFM)在Hf薄膜上进行局部氧化纳米光刻

摘要

Well controlled Hf oxide patterns have been grown on a flat Hf thin film surface produced by the dc magnetron sputtering method on Si and SiOx substrates. These patterns have been created by using the technique of semi-contact scanning probe lithography (SC-SPL). The thickness and width of the oxide patterns have been measured as a function of applied voltage, duration and relative humidity. There is a threshold voltage even at 87% humidity, due to insufficient energy required to start the oxide growth process for a measurable oxide protrusion. Electrical characterization was also performed via the I-V curves of Hf and HfOx structures, and the resistivity of HfO x was found to be 4.284 × 109 Ω cm. In addition to the I-V curves, electric force microscopy and spreading surface resistance images of Hf and HfOx were obtained.
机译:在直流磁控溅射法在Si和SiOx基板上生产的平坦Hf薄膜表面上生长了受控良好的Hf氧化物图案。这些图案是通过使用半接触式扫描探针光刻(SC-SPL)技术创建的。已经测量了氧化物图案的厚度和宽度作为施加电压,持续时间和相对湿度的函数。甚至在湿度为87%时也存在阈值电压,这是由于启动氧化物生长过程所需的能量不足以进行可测量的氧化物突出。还通过Hf和HfOx结构的I-V曲线进行电表征,发现HfO x的电阻率为4.284×109Ωcm。除I-V曲线外,还获得了Hf和HfOx的电镜和扩展表面电阻图像。

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