In the Matter of Certain Hardware Logic Emulation Systems and Components Thereof.Investigation No. 337-TA-383. Modification of Temporary Exclusion Order (November 1997)

摘要

Notice is hereby given that the Commission has determined to grant complainant'spetition to modify respondents' temporary relief bond in the above-captioned investigation. Respondents' temporary relief bond for all entries made since issuance of temporary relief in this investigation remains at 43 percent of the entered value of the subject imported articles if entered value equals transaction value as defined in applicable U.S. Customs Service regulations. Respondents' temporary relief bond for all entries made since issuance of temporary relief in this investigation is increased to 180 percent of the entered value of the subject imported articles if entered value does not equal transactions value as defined in applicable U.S. Custom Service regulations. The products at issue are hardware logic emulation systems that are used in the semiconductor manufacturing industry to test electronic circuit designs for semiconductor devices.