Damascene Process for Use in Fabricating Semiconductor Structures Having Micro/Nano Gaps.

摘要

In fabricating a microelectromechanical structure (MEMS), a method of forming a narrow gap in the MEMS includes (1) depositing a layer of sacrificial material on the surface of a supporting substrate, (2) photoresist masking and at least partially etching the sacrificial material to form at least one blade of sacrificial material, (3) depositing a structural layer over the sacrificial layer, and (4) removing the sacrificial layer including the blade of the sacrificial material with a narrow gap remaining in the structural layer where the blade of sacrificial material was removed.