This report describes the progress achieved towards the development of an elevated temperature resistant inorganic polymer structural adhesive,nIncreasingly severe thermal operating conditions have been engendered by high aircraft speeds. It is necessary to develop a structural adhesive that can satisfactorily withstand temperatures up to 1000°P.nAn inorganic adhesive stable at 800°F, with a room temperature shear strength of 285 lb./sq. in. has been obtained from the ammeline-phosphorus pentoxide reaction product.
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