Thermal Conductivity of Aluminum, Copper, Iron, and Tungsten for Temperatures from 1 K to the Melting Point

摘要

Data on the thermal conductivity of commercially pure aluminum, copper, iron, and tungsten specimens have been collected, coded, critically analyzed, and correlated with analytical techniques based on theoretical and empirical equations. The resulting functions are presented and used to generate tables and graphs of thermal conductivity as a function of temperature and residual resistivity ratio (RRR). An annotated bibliography of references is included. Discussions are included on the variations in thermal conductivity caused by chemical impurities, physical defects, size effects, and magnetic fields. Smoothed values are presented for temperatures from 1 K to near the melting point and for a large range of RRR values.