High Density Tactile Sensor Arrays for Curved Surfaces

摘要

The Phase I study established the feasibility of adapting ultrasonically-based tactile sensor technology to simply and compoundly curved finger structures. This was achieved by identifying suitable sensor substrate materials that are practical for use on curved surfaces, developing and exploring several wrap around tactile sensor designs, and instrumenting three finger tips with high-density arrays. There was consistent improvement in performance between prototypes, and solutions were developed for most of the problems experienced during sensor fabrication.