Durable Copper Polyimide Adhesive Bonds

摘要

With an optimum chemically converted surface on copper, durable structural adhesive bonds can be produced. By this particular alkaline oxidizing formulation and post-sealing, excellent structural bonds, which are both thermally and chemically stable, are achieved. The stability of these oxidized surfaces has been demonstrated thorugh extensive tensile lap shear, interlaminar shear testing, and verifying peel tests. Although bonding has been primarily evaluated with a polyimide adhesive, the effect of the hot alkaline oxidizing solution on epoxy fiberglass substrates was explored using the ASTM interlaminar shear bending test and electrical resistance comb pattern. Quantitative analytical procedures for constituents in the alkaline oxidizing bath aredescribed.