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Design Guidelines for Use of Adhesives and Organic Coatings in Hybrid Microcircuits

机译:混合微电路中粘合剂和有机涂层的使用设计指南

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A study was conducted to investigate the reliability of organic adhesives in hybrid microcircuits. The objectives were twofold: (1) to identify and investigate problem areas that could result from the use of organic adhesives and (2) to develop evaluation tests to quantify the extent to which these problems occur for commercially available adhesives. Efforts were focused on electrically conductive adhesives. Also, a study was made to evaluate selected organic coatings for contamination protection for hybrid microcircuits. (Author)

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