Thermoelectric Outer Planets Spacecraft (TOPS) Electronic Packaging and Cabling Development Summary Report

摘要

This document details electronic packaging and cabling activities performed in support of the Thermoelectric Outer Planets Spacecraft (TOPS) Advanced Systems Technology (AST) polecat. It describes new Electronic Compartment, Electronic Assembly, and Module concepts, and a new high-density, planar interconnection technique called Discrete Multilayer (I)ML). Development and qualification of high-density cabling techniques, using small-gage were and micro miniature Conductors, are also reported.