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Thermal Expansion of Composites Using Moire Interferometry

机译:用云纹干涉法对复合材料进行热膨胀

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An experimental technique for precise measurement of the thermal response of fiber-reinforced composite materials uses moire interferometry with fringe multiplication which yield a sensitivity of 833 nm (32.8 mu in.) per fringe. Results from the technique are compared with those obtained from electrical resistance strain gages, and also those predicted from classical lamination theory. Temperature dependent coefficients of thermal expansion for composite materials subjected to thermal cycling in the temperature range of 297 K (75 F) to 422 K (300 F) were determined for four laminate configurations (0, 90, 0/ + or - 45/90 sub s and 0/90/ + or - 45 sub s) of T300/5208 graphite epoxy, and ranged from -0.107 mu epsilon K/1 (-0.059 mu epsilon deg F/-) for the 0 laminate to 32.18 mu epsilon K/1 (17.88 mu epsilon F/1) for the 90 laminate. Moisture was found to greatly influence the thermal response of a quasi-isotropic laminate, resulting in hysteresis and residual compressive strain as the moisture content was reduced. Comparisons between moire and strain gage measurements were inconclusive with both techniques giving consistent but systematically different results. Differences of as much as 29% were observed.

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