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Minimum Curing Temperature of Cold-Setting and Fast-Setting Honeymoon Laminating Adhesives

机译:冷固和快速固化蜜月层压粘合剂的最低固化温度

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The minimum curing temperature of two cold setting laminating adhesives and four fast setting 'honeymoon' adhesives, was determined by the ability of the adhesive system to meet the weather and boil proof requirements of the British standard specification BS 1204 for synthetic resins adhesive for close contact joints, and the South African Bureau of Standards provisional specification, for exterior grade wood adhesives at the temperature chosen. The cold setting wattle tannin based and phenolic one component adhesive cannot be cured at temperatures of 20 C and below. Two of the 'honeymoon' systems can be cured at temperatures above 15 C. One of the 'honeymoon' systems can be cured at temperatures above 10 C. The completely phenolic 'honeymoon' system can be cured at a temperature as low as 5 C and possibly lower with little reduction in the rate of development of bond strength.

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