Low melting temperature alloy deployment mechanism and recent experiments

摘要

This paper describes the concept of a low melting temperature alloy deployment mechanism, U.S. Patent 4,842,106. It begins with a brief history of conventional dimethyl-silicone fluid damped mechanisms. Design fundamentals of the new melting alloy mechanism are then introduced. Benefits of the new over the old are compared and contrasted. Recent experiments and lessons learned complete this paper.