Characterization of Kova-Pyrex Anodically Bonded Samples: A New Packaging Approach for MEMS Devices

摘要

The ability to anodically bond Kovar to Pyrex 7740 significantly expands the packaging approaches available for MEMS devices. This technique greatly simplifies and reliably interconnects micropropulsion MEMS components (thrusters, valves) with the attached propellant system.