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Photoemission study of Au, Ge, and O(sub 2) deposition on NH(sub 4)F etched Si(111)

机译:au,Ge和O(sub 2)沉积在NH(sub 4)F蚀刻si(111)上的光发射研究

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We have studied the interaction of a metal, Au, a semiconductor, Ge, and a non-metal, O(sub 2), with the NH(sub 4)F etched Si(111) surface with photoemission spectroscopy. Two components were present in Si 2p core level spectra from the H-terminated surface. We observed the flat band condition from the as-etched, n-type, Si(111) surface. We performed stepwise depositions of Au and measured the band bending with photoemission spectroscopy. The Fermi level pinned near mid-gap as Au was deposited onto the as-etched surface. After the deposition of 1 ML of Au, a Au-silicide layer formed. This interfacial component indicated that the passivating H layer was compromised. As the Au coverage was increased, layers of pure Au formed between the bulk silicon and the Au-silicide layer. The observed behavior was nearly identical to that of Au deposition on the Si(111) 7 (times) 7 surface. Next, we tested the ability of the monohydride layer to sustain surfactant assisted growth of Ge. Ge islanding was observed at 400(degree)C indicating that good surfactant growth was not obtained. Although the monohydride layer was not a good surfactant for the Si(111) surface at this temperature, further study at different temperatures is needed to determine the ability of the ideal monohydride layer to act as a surfactant. Finally, we observed no oxidation of the as-etched surface at room temperature upon exposure to molecular oxygen.

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