Measurement techniques for evaluating encapsulant thermophysical properties during cure

摘要

Sandia now has the capability to evaluate stresses during cure of epoxies with finite element codes. Numerous material parameters are needed as input to these codes. I present a relatively quick set of tests which enable evaluation of the required thermophysical properties. Ease and accuracy of the tests improve as the reaction rate of the thermoset slows. Material parameters for common encapsulants at Sandia are presented in tables.