Converting printed wiring product processing to aqueous processable dry film photoresist. Final report

摘要

Fully aqueous processable dry film photoresists were evaluated to determine which dry film in the Federal Manufacturing and Technologies printed wiring board facility performed the best. The photoresists were chosen for their compatibility in alkaline etching, copper electroplating, and tin-lead electroplating. The processing evaluation included both single layer and double layer dry film photoresist for pattern plating.