Low-cost metal substrates for films with aligned grain structures

摘要

Polycrystalline metal substrates that possess a significant amount of in-plane and out-of-plane crystallographic texture have recently been developed for high-temperature superconducting film applications. These substrates enable the virtual elimination of large angle grain boundaries in subsequent epitaxial films, having been successfully utilized in various oxide thin film architectures. This paper describes the characteristics of these substrates, and briefly discusses their potential applicability in polycrystalline thin-film photovoltaic applications.