Multichip module technology development

摘要

This is the final report of a one-year, Laboratory Directed Research and Development (LDRD) project at Los Alamos National Laboratory (LANL). A Multichip Module (MCM) was designed and submitted for fabrication to the Lockheed Martin foundry using a licensed process called High Density Interconnect (HDI). The HDI process uses thin film techniques to create circuit interconnect patterns on multiple layers of dielectric film which are deposited directly on top of unpackaged electronic die. This results in an optimally small package that approaches the area of the bare die themselves. This project tested the capability of the Lockheed Martin foundry to produce, in an HDI process, a complex mixed-mode (analog and digital) circuit on a single MCM substrate.