Development and evaluation of sealing technologies for photovoltaic panels

摘要

This report summarizes the results of a study to develop and evaluate low temperature glass sealing technologies for photovoltaic applications. This work was done as part of Cooperative Research and Development Agreement (CRADA) No. SC95/01408. The sealing technologies evaluated included low melting temperature glass frits and solders. Because the glass frit joining required a material with a melting temperature that exceeded the allowable temperature for the active elements on the photovoltaic panels, a localized heating scheme was required for sealing the perimeter of the glass panels. Thermal and stress modeling were conducted to identify the feasibility of this approach and to test strategies designed to minimize heating of the glass panel away from its perimeter. Hardware to locally heat the glass panels during glass frit joining was designed, fabricated, and successfully tested. The same hardware could be used to seal the glass panels using the low temperature solders. Solder adhesion to the glass required metal coating of the glass. The adhesion strength of the solder was dependent on the surface finish of the glass. Strategies for improving the polyisobutylene (PIB) adhesive currently being used to seal the panels and the use of Parylene coatings as a protective sealant deposited on the photovoltaic elements were also investigated. Starting points for further work are included.