Direct-Write Precision Resistors for Ceramic Packages

摘要

A direct-write approach to fabricate high precision resistors is reported. Special attention is paid to the effect of print thickness on the resistance value of buried resistors after a low temperature co-firing process. The results show that the direct-write approach provides a superior line definition and thickness control over a traditional screen printing process. Microstructural analysis indicates that there is an interdiffused layer developed between the resistor material and the low temperature co-fired ceramic substrate.