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Effect of Substrate Configuration on the Grain Structure and Morphology of Electrodeposited Ni for Prototyping LIGA

机译:衬底配置对LIGa原型制备电沉积Ni晶粒结构和形貌的影响

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Synchrotron X-ray lithographic molding of PMMA-Ti/Cu/Ti substrates has been developed and used in the electrodeposition of Ni microparts for prototype LIGA development at SNL, CA. Alternative molding processes that minimize xray beam line use and reduce processing time are of interest for the rapid fabrication of large quantities of microparts. The objective of this investigation is to examine, archive, and compare the grain structure and morphology of deposits produced from four different molding technologies currently under development. We conclude that deposit microstructure and uniformity are greatly influenced by substrate material and design configuration.

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