EVALUATION OF PLATED-THROUGH CONNECTIONS FOR PRINTED CIRCUIT BOARDS

摘要

The present report describes the evaluations conducted with plated-through connections produced by techniques used by some of the prominent fabricators of printed circuit boards.nThe following topics are discussed in detail:(1) concepts of metallizingndielectric surfaces by "copper reduction" or "immersion deposition," (2) step-by-step processing techniques for producing quality plated-through connections, (3) environmental results of plated-through connections, (4) in-process and final inspection of plated-through interconnects, (5) Sandia Corporation specification for insuring quality of the through-connects, and (6) future applications of the plated-through technique.