Interface Formation and the Adhesion of Deposited Thin Films

摘要

A discussion is given of the types of interfacial regions which may be formed between a film and a substrate. Various deposition techniques are compared as to their ability to form the various types of interfacial regions. The mechanism of failure of the bond between film and substrate is discussed in terms of the type and structure of the interfacial region. The reasons for poor adhesion are discussed and approaches for overcoming adhesion problems are presented. The deposition process of 'ion plating' is presented as one technique for overcoming many adhesion problems.