Effects of Gas Plasma on Printed Circuit Board Materials

摘要

The project was established to define gas plasma process parameters for printed circuit board cleaning without damage to the substrate. Process parameters of gas flow, wattage, and time are defined for both oxygen and argon treatments. The surface activity changes of plastics and printed circuit board materials are described. A preliminary evaluation of the life (surface activity) of these materials after plasma treatment is presented. Swell index, contact angle, and Meseran analysis tests were used to measure process parameters, plasma life, and surface changes. (ERA citation 04:014313)