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ELECTRODEPOSITION PROCESS CONTROL EQUIPMENT

机译:电沉积过程控制设备

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The purpose of this project was to improve the reliability of electronic systems used to control and monitor precision electro-deposition processes.nA new X-ray fluorescence analysis system was assembled to perform automatic analysis of element ratios in plated alloys. Information from this system is used to keep the alloy plating operation under control. A programmable calculator converts raw photon-count data to usable alloy ratios, and makes the system independent of external computer support. Software was developed which facilitates data recording, analysis, and printout, and corrects for minor shifts in photon energy calibration, thus eliminating a possible source of error. The reduction in system complexity has resulted in improved reliability with respect to the previous X-ray analysis system.

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