Automatic Physical Design of Large Wire-Wrap Digital Systems

摘要

A system is described which automatically performs the detailed physical design of a wire-wrap digital system, given a completed logical design, chip placement, and user-specification of the particular component technology and wire-wrap package to be used. The system approximately optimizes measures of the manufacturability, reliability, and performance level of the physical design, as defined by parameters provided by the user. The system's models of the wire-wrap environment and component technologies are surveyed, and its major algorithms for physical design are discussed in detail. These models and algorithms are novel in that they are detailed enough to allow the complete high-quality physical design of large, high-performance central-processing units. Furthermore, they are designed to be easily adapted by the user for specific design efforts. (ERA citation 07:008496)