Silicon Dendritic Web Material Process Development. First Quarterly Report, March 28-June 30, 1980

摘要

Initial values of pressure, power, and speed have been determined for seam bonding interconnects to dendritic web solar cells. Satisfactory bond strengths and high yield have been achieved without cell damage. However, in case of processing large numbers of cells for module fabrication, further testing is required to assure reproducibility of this technique. Various techniques have been developed for fabricating solar modules by lamination using ethylene vinyl acetate with a glass superstrate, and no cell breakage has been noted. (ERA citation 05:034641)