Development of Metallization Process: FSA Project, Cell, and Module-Formation Research Area. Quarterly Technical Progress Report No. 6329-15 for the Period Ending June 30, 1983

摘要

A non-lead frit paste was received from Thick Film Systems Inc. and evaluated. The results were not promising. Additional work was done on a two-step process where the bulk of the metallization is Mo/Sn but a small ohmic pad is silver. This approach was successful. A new matrix of paste formulations was developed with JPL and Electrink, Inc. personnel. A series of 12 pastes was ordered from Electrink, Inc. (ERA citation 09:002102)