Isothermal reacting comparison of DGEBA (diglycidyl ether of bisphenol A)-type epoxy resins.

摘要

The trend toward miniaturization of electronic components has prompted the need for materials with improved dielectric properties and decreased tendency to promote corrosion resulting from low levels of ionic impurities. Epoxy resins based on the diglycidyl ether of bisphenol A (DGEBA), which have reduced levels of total, ionic, and/or saponifiable chlorine, have recently been introduced commercially for use in microelectronic applications. These electronic-grade resins have been either manufactured specifically to reduce, or purified to remove, the molecular species that are responsible for the ionic and saponifiable chlorine. Because some of these species have been shown to affect the bulk resin processing parameters, a study was undertaken to compare the reactivities of some electronic-grade resins to the non-electronic-grade materials. This paper presents the results of the DSC kinetic study performed on commercially available DGEBA resins to determine if process changes were required to replace a traditional DGEBA-type resin with a reduced chlorine version. 2 refs., 5 figs., 2 tabs.