首页> 美国政府科技报告 >Incision of UV (Ultraviolet) Irradiated DNA in Yeast: Progress Report, November 1, 1988-June 7, 1989
【24h】

Incision of UV (Ultraviolet) Irradiated DNA in Yeast: Progress Report, November 1, 1988-June 7, 1989

机译:在酵母中切割UV(紫外线)辐照的DNa:进展报告,1988年11月1日 - 1989年6月7日

获取原文

摘要

Our objectives are to determine the details of the incision step of excision repair following exposure to UV light in the eucaryotic organism, the yeast Saccharomyces cerevisiae. We have focused on three of the ten genes involved in this process -- RAD1, RAD3, and RAD10. We have purified RAD3 protein to near homogeneity, and it possesses single-stranded DNA-dependent ATPase activity and DNA helicase activity which translocates in the 5' implies 3' direction. Site-directed mutagenesis was used to change amino acid residues in a region thought to be required for nucleotide binding and the biological effects of these mutations determined. RAD1 protein is also being purified and RAD10 protein has been purified to near homogeneity. We can now begin to examine RAD10's role in excision repair. A conserved pattern of antisense overlapping transcription has been noted in the yeast RAD10 gene region and in the homologous human ERCC-1 gene. Analysis of the overlapping genes in this region has been carried out. The human RAD3 homolog ERCC-2 is also being studied. Since defective DNA repair and enhanced neoplasia characterize several human genetic diseases, a thorough understanding of the molecular mechanisms of DNA repair may provide a better understanding of the causes of carcinogenesis.

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号