Superplastic creep of eutectic tin-lead solder joints.

摘要

Creep behavior of air-cooled and liquid nitrogen-quenched soldered joints of 60/40 Sn-Pb at 65(degree)C has been studied. The stress exponent, n, in the power law, (gamma) (steady state strain rate) (proportional to) (sigma)(sup n) (applied stress), chang ...