Vertical Cavity Lasers Integrated onto Silicon Circuits

摘要

Mow to integrate optoelectonic devices with Si ICs is the key to the success of the optical interconnect technology. The substrate removal technique uses mechanical polishing and wet chemical etching to remove the substrate. After removal of the substrate, metal layers are deposited on the backside of the wafer and the VCSEL devices are ready to be mounted onto SI chips. The removal of the substrate enables the flip-chip bonding for 850 run VCSELs and reduces the height of the defices.