Channel Constrained Metalization (CCM), which employs photoresist patterning to confine electroless metal deposition to selected regions, is an inexpensive alternative to metal sputtering or evaporation. Using CCM we deposited arrays of square nickel electrodes up to one micron in thickness and between 11 microns and 44 microns on the side. Gaps between the electrodes ranging from 1 micron to 4 microns were successfully patterned. In preliminary experiments, we have already achieved a reflectivity of up to 94% and an r.m.s. surface roughness of 3.3 nm evaluated on a pixel size (20 micron square) area.
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