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Development and Validation of a Finite Element Based Method to DetermineThermally Induced Stresses in Bonded Joints of Dissimilar Materials

机译:基于有限元法确定异种材料粘结接头热诱发应力的研究与验证

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摘要

A validation is carried out of the steady state thermal stress analysiscapability of the PAFEC Finite Element program. Two problems are considered for which closed form solutions can be obtained: these comprise the thermal stresses in a heated circular plate and also a bonded joint. Also, a procedure is developed for calculation of residual stresses in bonded joints. Comparisons with closed form solutions indicate the degree of discretisation necessary to achieve accurate results.

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