Effect of Processing Variables on the Structure and Properties of Polymer Interphases

摘要

The effect of processing variables on the molecular structure and properties of interphases formed between polyimides and metal substrates was determined. Polyimide films were formed on aluminum substrates by spin-coating of polyamic acid followed by thermal imidization and by vapor-codeposition of the monomers followed by thermal imidization. Spin-coating of polyamic acid and thermal imidization were also used to deposit polyimide films on gold substrates. Films were formed on silver substrates by Langmuir-Blodgett deposition of alkylamine salts of polyamic acid followed by chemical imidization. 4-mercaptophenylphthalimide, a model polyimide, was adsorbed onto gold substrates by adsorption from solution. The films were characterized as appropriate by X-ray photoelectron spectroscopy (XPS), reflection-absorption infrared spectroscopy (RAIR), and surface-enhanced Raman scattering (SERS). The fracture energy required-to delaminate polyimide films from aluminum and gold substrates was determined using the circular blister test. Finite element analysis was used to determine the effects of plastic deformation on a global scale' on the fracture energy.