Design for Packageability; Early Consideration of Packaging from aMicroelectronic System Designer's Viewpoint

摘要

The goal of this project was to assist in globally optimizing the design ofhigher performing microelectronic systems by incorporating critical packaging factors into the IC design flow. More specifically, our work was intended to empower system designers, especially designers of multi-million transistor ICs, to obtain optimized MCM-based systems.