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Thermal Isolation and Differential Cooling of Heterogeneously Integrated Devices.

机译：异构集成器件的热隔离和差分冷却。

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作者
McCluskey, P.;
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年度 2016
页码 1-59
总页数 59
原文格式 PDF
正文语种 eng
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关键词
Integrated circuits; Thermal resistance; Thermal conductivity; Semiconductors; Thermal management; Heterogeneous integration; Via array; Thermal isolation;

机译：集成电路;热阻;导热系数;半导体;热管理;异构集成;通孔阵列;热隔离;

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Thermal Isolation and Differential Cooling of Heterogeneously Integrated Devices.

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