Understanding Thermal Transport in Graded, Layered and Hybrid Materials

摘要

The overall research goal is to gain a detailed understanding of thermal transport through multilayered interfaces between dissimilar materials, using a combination of time-domain spectroscopy, physical modeling and materials processing. Specific goals for the overall project include; (i) investigate the structure, thickness and morphology of the copper-diamond interface for various processing conditions; (ii) assess the effect of interfacial morphology on bulk thermal conductivity, using appropriate models; (iii) publish the results of experimental investigations into bulk thermal properties of copper-diamond composites with various interfacial chemistries, including metallic and carbide layers, and; (iv) mimic the observed interface structure on a TDTR specimen by manipulating the various deposition techniques available to us experimentally.