Development of Processable, Low Cure Shrinkage Adhesives

摘要

Adhesively bonded structures offer weight savings, ease of fabrication, and absence of stress concentrations arising from holes and fasteners. However, the drawbacks of current high performance resins, i.e. high paste viscosity and chemical cure shrinkage, often present uncertainties in the quality and durability of the bondlines. This program presents methodologies and approaches that seek to mitigate these difficulties through innovative chemical modifications and blending of monomers.