Textured Copper Metallic Substrates for 2nd Generation High Temperature Superconductor Applications

摘要

Sharp cube textured Cu (100) tapes have been produced as a possible substrate for epitaxially grown conductive, intermediate metallic or ceramic buffer layers with subsequent deposition of high critical current density YBa2Cu307-x (YBCO) films. Cu substrates were fabricated from rods and foils by smooth cold rolling followed by recrystallization. Detailed x-ray diffraction (XRD) studies along with orientation imaging microscopy were performed to measure the inplane alignment, out-of-plane alignment and microtexture for different annealing temperatures. The best full width half-maximum (FWHM) values of 5.4 deg for in-plane alignment and 5.8 deg for out-of-plane alignment were obtained at 750 deg C annealing temperature. Microtexture results indicate more than 97.5% of grains have less than 10 deg misorientation.