VXS, A High Speed Cu Switch Fabric Interconnect for VME

摘要

VXS provides the VME architecture with an infusion of new technology and a roadmap for evolution while remaining backwards compatible. These seemingly opposing goals were achieved by careful planning and judicious selection of technologies. The platform level enhancements over the existing VME platform include improvements in mechanical packaging, 10 Gbs switch fabric interconnect technology, system management features, alignment and keying strategy, 2X power improvements, and cooling strategies. This work was done within the context of the VSO industry standards body to promote an eco-system of developers, vendors, and users. The focus of this paper is the 10 Gbs switch fabric interconnect technology. In the maximum configuration defined by the VXS standard, the interconnect technology allows up to eighteen payload and two switch boards to be topologically connected with redundant 4x LVDS (Low Voltage Differential Signaling) links in a dual star configuration that fits within a 19 rackmount chassis. The connector technology, MultiGig RT2, is based on a non-traditional PCB chicklets mounted on the plug-in daughter card that has carefully controlled impedance and optimized footprints. The backplane connector uses traditional beam contacts. Density and robustness of the connector exceed most conventional pin and socket interconnects.