Copper Metallic Substrates for High Temperature Superconducting Coated Conductors

摘要

Biaxially cube textured polycrystalline Cu(200) substrate tapes were produced for high temperature superconducting (HTS) coated conductor applications. A comparison is made between Cu substrates fabricated by reverse cold rolling followed by recrystallization, from stock materials that were obtained in the form of extruded rod and rolled plate. Detailed x-ray diffraction (XRD) studies and orientation imaging microscopy (OIM) were performed to measure the in-plane alignment, out-of-plane alignment, and microtexture at various deformation levels and annealing temperatures. The rod starting geometry proved to have superior biaxial alignment with a predominant (220) deformation texture after rolling.