Sample Fabrication and Experimental Approach for Studying Interfacial Sliding in Thin Film-Substrate Systems

摘要

The purpose of this thesis was to develop an experimental methodology to determine the mechanisms and kinetics of sliding at the interface between a metallic thin film and substrate. A methodology was developed and used to study interfacial sliding of aluminum films on silicon substrates and copper films on fused quartz substrates. The methodology employed a lap shear type of geometry to load the interface between the film and substrate in shear. The results of the studies were inconclusive with regard to interfacial sliding. In the case of Al-Si, the sample fabrication process increased the interfacial amplitude to an extent that the sliding rate was essentially zero. In the case of Cu-Fused Quartz, chromium film was added to the sample to aid the adhesion of Cu to fused quartz and as a result reduced the sliding rate below detectable levels.