首页> 美国政府科技报告 >New Dimensions in Microarchitecture Harnessing 3D Integration Technologies (BRIEFING CHARTS)

【24h】

New Dimensions in Microarchitecture Harnessing 3D Integration Technologies (BRIEFING CHARTS)

机译：微体系结构中利用3D集成技术的新维度（简要图表）

获取原文

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Bernstein, K.;
展开▼
作者单位

展开▼
年度 2007
页码 p.1-13
总页数 13
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Computer architecture ; Symposia ; Military research ; Client server systems ; Bandwidth ; Military planning ; Defense planning ; Reprints ; Central processing units;

机译：计算机体系结构;专题讨论会;军事研究;客户服务器系统;带宽;军事规划;国防计划;重印;中央处理单元;

相似文献

外文文献
中文文献
专利

1. Redefining 3Dimensional placental membrane microarchitecture using multiphoton microscopy and optical clearing [J] . Richardson Lauren, Vargas Gracie, Brown Tyra, Placenta . 2017,第期

机译：使用多虹柱显微镜和光学清除重新定义3Dimensional胎盘膜微体系结构
2. Three-Dimensional (3D) Microarchitecture Correlations with 2D Projection Image Gray-Level Variations Assessed by Trabecular Bone Score Using High-Resolution Computed Tomographic Acquisitions: Effects of Resolution and Noise [J] . Winzenrieth Renaud, Michelet Franck, Hans Didier Journal of clinical densitometry . 2013,第3期

机译：使用高分辨率计算机断层扫描获取的骨小梁评分评估的具有二维投影图像灰度级变化的三维（3D）微体系结构相关性：分辨率和噪声的影响
3. Investigating the Effects of Fine-Grain three-Dimensional Integration on Microarchitecture Design [J] . YUCHUN MA, YONGXIANG LIU, EREN KURSUN, ACM Journal on Emerging Technologies in Computing Systems . 2008,第4期

机译：研究细粒度三维集成对微体系结构设计的影响
4. Microarchitecture soft error vulnerability characterization and mitigation under 3D integration technology [C] . Wangyuan Zhang, Tao Li IEEE/ACM International Symposium on Microarchitecture . 2008

机译：微架构软错误漏洞脆弱性表征和3D集成技术下的缓解
5. Exploring emerging three-dimensional integration and memory technologies in processor microarchitecture design [D] . Zhang, Wangyuan 2010

机译：探索处理器微架构设计中新兴的三维集成和内存技术
6. Harnessing smartphone technology and three dimensional printing to create a mobile rehabilitation system mRehab: assessment of usability and consistency in measurement [O] . Sutanuka Bhattacharjya, Matthew C. Stafford, Lora Anne Cavuoto, 2019

机译：利用智能手机技术和三维打印创建移动康复系统mRehab：评估可用性和一致性
7. Bumpless Through-Dielectrics-Silicon-Via (TDSV) Technology for Wafer-based Three-Dimensional Integration (3DI) [O] . Takayuki Ohba 2016

机译：用于基于晶圆的三维集成（3DI）的无扰动贯穿电介质 - 硅通孔（TDsV）技术

New Dimensions in Microarchitecture Harnessing 3D Integration Technologies (BRIEFING CHARTS)

著录项

引文网络

相似文献

相关主题

期刊订阅