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Corn Hybrid Polymer Media for Coatings Removal from Delicate Substrates

机译：玉米杂化聚合物介质，用于从精致基材上去除涂层

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作者
Yallaly, B;
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年度 2008
页码 1-35
总页数 35
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Chp media; Coating removal; Briefing charts; Chp(Corn hybrid polymer); Stripping; Blasting media; Proof-of-concept; Corn starch;

机译：Chp媒体;涂层去除;简报图; Chp（玉米杂化聚合物）;剥离;爆破媒体;证明的概念;玉米淀粉;

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专利

1. Removal of coatings from polymer substrates by solid particle blasting to enhance reuse or recycling [J] . P. H. Shipway, J. P. D. Bromley, D. P. Weston Wear: an International Journal on the Science and Technology of Friction, Lubrication and Wear . 2007,第1a6期

机译：通过固体颗粒喷砂去除聚合物基材上的涂层，以提高再利用或再循环能力
2. Preparation and Characterization of Polymer-Alumina Hybrid Hard Coatings with High Hardness on Plastic Substrate [J] . Byung Min Park, Yeun-kyong Cho, Seok-ho Hwang, SID International Symposium: Digest of Technology Papers . 2017,第2期

机译：塑料基材高硬度的聚合物 - 氧化铝杂交硬涂层的制备与表征
3. Development of hybrid amorphous barrier coatings on polymer substrates [J] . Liang Chih-Hao, Chau Joseph Lik Hang, Pan Alfred I-Tsung, Proceedings of the Institution of Mechanical Engineers. Part L, Journal of Materials: Design and Application . 2016,第L2期

机译：聚合物基体上混合非晶无定形涂料的开发
4. Formation of Metal Coatings on Polymer Substrates in Wide Thickness Range under Conditions of Adjustable Substrate Outgassing [C] . E. Yadin, I. Ashmanis, Y. Lipin International conference on vacuum web coating . 1997

机译：在可调除气条件下，在宽厚度范围的聚合物基板上形成金属涂层
5. The effects of electron beam-cured coatings on polymer substrates. [D] . Nordin, Norbismi. 2005

机译：电子束固化涂层对聚合物基材的影响。
6. Organic-Inorganic Hybrid Planarization and Water Vapor Barrier Coatings on Cellulose Nanofibrils Substrates [O] . Feyza Karasu, Luca Müller, Hassan Ridaoui, 2018

机译：纤维素纳米原纤维基质上的有机-无机杂化平面化和水蒸气阻隔涂层
7. Investigation of Coating Performance of UV-Curable Hybrid Polymers Containing 1H,1H,2H,2H-Perfluorooctyltriethoxysilane Coated on Aluminum Substrates [O] . Mustafa Çakır 2017

机译：含有1H，1H，2H，2H-全氟辛基三乙氧基硅烷的紫外光固化杂化聚合物在铝基体上涂层性能的研究

Corn Hybrid Polymer Media for Coatings Removal from Delicate Substrates

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