Photoelastic Analysis of Shear Stress Distribution in Adhesive-Bonded Lap Joints

摘要

A photoelastic analysis was made of the shear stress distribution in an .064-inch aluminum alloy, adhesive-bonded lap joint. The adhesive that was used was a photoelastic material. The stress distribution was studied directly on the adhesive itself in the joint as a function of increasing load and length of overlap of the adherends. The experimental distribution that was obtained was compared with that predicted by the theoretical analysis of Goland and Reissner. (Author)