A Method for Predicting Thermal Response in Sandwich Panels

摘要

This study was undertaken to develop and demonstrate the validity of an analytical model for predicting the transient temperature response in honeycomb sandwich panels subjected to variable heat loads on one or both faces. A one-dimensional analysis was developed which employs the ordinary heat balance considering heat transfer through the panel by conduction, convection, and radiation. The finite (forward) difference technique is employed for solving the heat balance equations. Honeycomb panels of various materials, cell shapes, and dimensions were subjected to a variety of heat loads and their thermal responses were recorded. The predicted thermal responses for these panels, obtained with the analytical model, were in good agreement with the test data. (Author)