A Porous Substrate Resistor Aimed at Miniaturization of Metal-Film Resistors

摘要

Temperature gradients resulting from electrical loading were found not to be the fundamental cause of resistance shift or hysteresis. One likely source of contamination namely, wax from the slicing and dicing operation to produce substrates was similarly found not to be a cause of resistance shift. A better reflux cleaning cycle, however, evolved which allows better quality metallizing as determined visually. The actual cause of resistance shift could not be determined. Porous substrates exhibiting the most uniform structure produce resistors with the smallest % deviation in resistance. An initial investigation of solid impregnants indicates that a broad range of stiffness (modulus of elasticity) of the impregnant material can be successfully employed. (Author)