Enhanced Micro-Module Interconnections. An Hermetic Packaging System for the Integration of Micro Circuits

摘要

Fifteen engineering model design enhanced micro modules were assembled and tested under the following environments; thermal shock, vibration, mechanical shock, and leak tests. Ten ten-stage binary divider enhanced micro modules were also assembled and tested. These modules demonstrated the compatibility of the interconnection-packaging system with solid state integrated circuits. The electroplated portion of the terminated microwafer was increased in length from .005 to .009 inches to eliminate opens which were occurring during stack welding. The microwafer stack welding machine in conjunction with the automatic electron beam programmer was installed within the electron beam machine and its functions checked. All eleven brazing fixtures required for the fabrication of the header-transfer wafers are operational. Significant strides toward the goal of developing the laboratory, electroplating facility into a production facility were also made during this period.